Miniaturization of engineering systems leads to requirements for intensive heat transfer internally and between systems and their environment. Heat transfer may become a limiting influence on performance. Boiling and condensation processes are potentially very efficient modes of heat transfer and can be used in a wide range of engineering systems, e.g. for the cooling of microelectronic components or the operation of some power and refrigeration systems, fuel cells and chemical reactors. The wide range of applications includes aerospace and transport, cooling and heating systems for the built environment, electronics and opto-electronics, personal computers and communications and the process industries. This is illustrated by the range of activities of the Industrial Participants in this project.
As the scale of a system is reduced, boiling and condensation become increasingly influenced by the interaction between surface tension forces and the micro-geometry of the flow passages. The main objectives of this project are:
The project brings together Academic Partners with extensive experience in boiling, condensation, micro-fabrication and numerical simulation. A special feature of the project is the synergistic investigation of common features of flow boiling and condensation in microchannel flows that are strongly influenced by surface tension. Brunel, Edinburgh and Heriot Watt will conduct experimental and theoretical investigations of different aspects of flow boiling, Queen Mary College will investigate condensation and Nottingham will develop numerical simulations by continuum and molecular methods in collaboration with the other partners, see Table below.
| Univ. | Conditions | Fluids | Pressure |
|---|---|---|---|
| boiling, electrical heat source | |||
| BU | Single channel, variable cross-section, silicon substrate. Passive and active control of flow, bubble nucleation. |
R134a, water | 1 - 5 bar |
| EDU | Parallel channels, non-uniform heat flux, silicon substrate. Flow distribution and interactions between channels. Interactions by conduction in silicon substrate. Micro-fabrication of channels and sensors. |
R134a, water | 1 - 2 bar |
| HWU | Multi-channels with and without interconnections, including tube bundles, metal substrates. Flow regimes, pressure drop, dryout. |
R134a, 141b, PFCs | 1 - 10 bar |
| condensation, water heat sink | |||
| QMUL | Parallel channels (metal extrusions) with optimised microchannel geometry and microchannels with microfins. Superheated and saturated incoming vapour; model fluids with widely different properties. |
FC72, H2O (expt. and theory) R134a, R22, R410a, R152a, CO2 (theory) |
Any (theory) Near atm (expt.) |
| numerical simulation | |||
| NU | Bubble growth in single and cross-connected channels. Thin film heat transfer and flow due to axial stresses and lateral pressure gradients caused by variations in interfacial curvature. Heat transfer across ultra-thin films and liquid-vapour-solid contact zones, including non-equilibrium in Knudsen layer. Conduction between the main heat transfer zone and end connections. |
Any | Any |